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[Equipment Introduction] Cylindrical Grinding Machine (Okamoto OGM)

We offer a variety of grinding stones, including diamond, borazon, and WA, capable of accommodating many materials.

The secret of Tokiwa Seiko's technology, which responds to diversifying needs, lies in its wide range of in-house equipment. In cylindrical grinding, we offer various grinding wheels such as diamond, borazon, and WA, enabling us to accommodate many materials. For powder metallurgy mold punches, it is common to finish the outer diameter with a mirror surface. Typically, two processes are required: finishing the dimensions with cylindrical grinding and then polishing to achieve a mirror finish. However, at Tokiwa Seiko, we have developed a method that allows us to finish the dimensions and achieve a mirror surface simultaneously during the cylindrical grinding process, enhancing efficiency. If you have specific requests such as "I only want to rely on this equipment for processing," we can also perform pinpoint processing using available equipment. Please contact us, and we will provide updates on the machine's operational status. *For more details, please refer to the PDF or feel free to contact us.

  • Processing Contract

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